CoolIT Systems at SC 2018

CoolIT Systems at SC 2018

Efficiently scale HPC with Direct Liquid Cooling

The rise of Artificial Intelligence and Machine Learning is driving up power densities inside data centers around the world. Leading chip manufacturers continue to push computational boundaries with the release of high TDP processors that traditional air cooling methods are struggling to manage. Join CoolIT Systems at Supercomputing 2018 (SC18) in Dallas, Texas during November 12-15, 2018 to experience how CoolIT’s modular portfolio of Direct Liquid Cooling products is efficiently enabling HPC from significant increases in server and rack density to lower energy costs and overall data center TCO.

Unlock data center performance potential whilst lowering TCO –
Visit booth #2819

CoolIT’s leadership in reliable and intelligent liquid cooling solutions is paving the way to extremely dense, performance optimized, energy efficient data centers. Through the combination of Passive Coldplate Loops, Manifolds and Coolant Distribution Units (CDUs), CoolIT’s modular Rack DCLC technology enables extreme-scale computing to support HPC systems for government, academia and enterprise.

CoolIT Activities at SC18

booth

Showcase: Preview Latest Liquid Cooling Solutions

CoolIT and their partners are delivering the most complete and robust liquid cooling solutions to the HPC market. Walk through CoolIT’s latest coldplate innovations for Intel, AMD and NVIDIA processors as well as its broad range of high-capacity Coolant Distribution Units. As the leading liquid cooling integration partner for OEM server manufacturers, CoolIT will showcase it’s latest liquid-enabled solutions:

  • Intel Buchanan Pass
  • Dell EMC PowerEdge C6420
  • Cray Shasta
  • STULZ Micro Data Center
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Customer Stories

Considering Direct Liquid Cooling for your next HPC deployment? Want to know more about CoolIT’s technology and existing installations? Visit booth #2819 to learn about how our reliable, modular  Rack DCLC solutions are enabling higher performance, density and efficiency for our wide range of global customers, including:

  • Frontera supercomputer at TACC
  • Pitzer HPC Cluster at OSC
  • Containerized data center for CHIME radio telescope
  • Eagle Cluster at PSNC

TECHNICAL PRESENTATIONS

Join CoolIT liquid cooling experts for technical presentations during SC18:

Monday November 12, 2018

9:30am | Dell EMC HPC Community Meeting, Fairmont Dallas

Technology of TACC Frontera: Enabling the world’s fastest academic supercomputer with high-density Direct Liquid Cooling

Purpose built for high performance, hyperscale workloads, the liquid cooled Dell EMC PowerEdge C6420 is the ideal foundation to enable TACC Frontera’s goal of expanding HPC to drive critical scientific and research advancement.

Tuesday November 13, 2018

11:30am | SC18 Booth #3218 (Dell EMC booth theatre)

Empowering energy efficient HPC systems with Direct Liquid Cooled Dell EMC servers

Dell EMC and CoolIT Systems have partnered to provide a factory-installed and warranty supported Direct Liquid Cooling solution to address power and cooling challenges for a wide range of HPC customers. Learn how PowerEdge C6420 enables greater data center performance, efficiency, density and scalability for systems such as TACC Frontera and OSC Pitzer Cluster.

LEARN MORE ABOUT SC18

SC18 is the world’s largest marketplace for HPC and networking professionals, bringing together scientists, engineers, researchers, educators, developers and more.

JOIN THE #SC18 CONVERSATION

@CoolITSystems
@Supercomputing
#SC18
#HPC
#LiquidCooling

Recap of CoolIT @ ISC18