Rising to AI’s Cooling Demands: How CoolIT Delivers Speed, Scale, and Flexibility

AI is redefining what data centers can handle — and what they can’t. As next-generation GPUs push beyond 1,000 W TDP per chip and AI racks projected to exceed 1MW, traditional air cooling has hit its practical limits. Performance stalls, energy costs climb, and operators are forced to rethink entire power and cooling architectures just to keep pace.
For over two decades, CoolIT Systems has worked behind the scenes to advance direct liquid cooling technology for the world’s leading hyperscalers, OEMs, and processor manufacturers. Now, as AI drives an unprecedented surge in high-density compute, CoolIT is scaling up precisely where the industry needs it most: engineering agility, manufacturing scale, and speed to market.

Engineering Agility

CoolIT’s engineering team works closely with customers and partners to design liquid cooling technology to meet their needs. Because the pace of change and innovation for customers has accelerated, we have invested significantly in engineering, rapid prototyping and design tools.

We have expanded our capacity to design and validate liquid cooling technology at the pace AI workloads require. Our Liquid Lab™ Innovation Centers in Calgary and Taipei combine rapid prototyping, CFD modeling, mechanical testing, and in-house UL certification under one roof. By compressing iterations within a single controlled environment, we cut development cycles dramatically — moving from design concept to production-ready hardware in months without compromising on quality or reliability.

Every CoolIT product, from coldplate to CDU, is developed under a Design-for-X discipline, which prioritizes performance, reliability, manufacturability, and serviceability from day one.

Manufacturing Scale

CoolIT has strategically increased its global manufacturing footprint to support rapid volume ramp-up. The flagship Starfield facility in Calgary, spanning 112,000 sq. ft., anchors North American production and complements capacity in Asia. Together, these expansions have multiplied CoolIT’s total manufacturing footprint by more than 25 times compared to its original capacity — a necessary step as AI adoption accelerates.

Inside these facilities, automated assembly lines, AI-enabled optical inspections, and end-of-line functional testing maintain consistent quality at scale. This disciplined approach allows CoolIT to meet volume demands for large hyperscale and HPC deployments without sacrificing reliability.

Supply chain resilience is equally critical. CoolIT dual-sources key components and diversifies supplier geographies, ensuring production agility even in volatile global conditions.

Speed to Market and Flexibility

Innovation must match the speed of silicon design cycles. When bringing a new product to market, CoolIT works closely with customers to define performance, reliability, and production requirements.

For example, in our Liquid Lab™ Innovation centers, we can rapidly design, prototype, test, and validate—as well as UL certify—new products all in-house. This allows us to compress development timelines without compromising quality or reliability. Take the development of a cooling loop for a customer’s new server SKU. We can move quickly into development because we’ve already worked with silicon manufacturers to develop coldplates that are fully optimized and validated for their next-generation processors. We leverage existing components where possible to improve supplier qualification and testing cycles. Well-defined test and validation processes provide clarity and an established supplier base and high-volume manufacturing capacity mean we can scale production.

Flexibility is another necessity. Hyperscale customers rarely rely on one-size-fits-all infrastructure. Each datacenter is designed around the customer value and application to be delivered, and the infrastructure is optimized to most efficiently deliver those workloads. What this means is that we build products that use common-off-the-shelf components but are designed for the unique customer requirements. To this end, we’ve developed a portfolio of modular, interoperable components that we can use to get a product to market quickly.

The result is a practical balance: customers benefit from the performance and reliability of mature, standardized parts while still receiving a custom-engineered cooling solution tailored for their next-generation workloads.

Ready for the AI wave

Cooling will define how far AI can scale. Direct liquid cooling is not optional — it is now fundamental to sustaining performance and efficiency at densities where air cooling fails.

For more information on CoolIT’s end-to-end direct liquid cooling products, visit: https://www.coolitsystems.com/products/

About CoolIT Systems

CoolIT Systems specializes in scalable liquid cooling solutions for the world’s most demanding computing environments. A 24-year pioneer in microprocessor liquid cooling systems, CoolIT’s technology cools over 5 million GPUs and CPUs globally. In the AI, high-performance computing and enterprise data center markets, CoolIT partners with global processor and server design leaders to develop the most efficient and reliable liquid cooling solutions for their leading-edge products. Through its modular direct liquid cooling (DLC) technology, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. Together, CoolIT and its partners are leading the way for the widespread adoption of accelerated and advanced computing.

For more information about CoolIT Systems and its technology, visit https://www.coolitsystems.com/ and follow @CoolIT Systems on LinkedIn. 

Media Contact
Charles Robison
Director, Marketing
CoolIT Systems
media@coolitsystems.com