02.12.2025 | Blog Posts, News, Products & Technology

CoolIT Systems Scales North American Manufacturing to Cool AI’s Next Wave

When the world’s most powerful AI and high-performance computing systems demand more cooling muscle, CoolIT Systems has been there, quietly leading the charge.

As AI workloads balloon and data centers race to keep pace, the challenge is no longer just about raw computing power — it’s how to cool those machines efficiently, reliably, and at scale. For over two decades, CoolIT has been pushing the boundaries of liquid cooling technology, establishing itself as the go-to partner for hyperscalers, OEMs, and semiconductor leaders worldwide.

Bird’s-eye view of CoolIT’s Starfield manufacturing facility in Calgary, Canada

Now, with the opening of their Starfield manufacturing facility in Calgary, Canada, CoolIT is doubling down on its commitment to lead the market through a surge of demand driven by AI infrastructure buildouts.

Building Capacity Where It Counts

Scaling production 25X in just the past 18 months is no small feat. But that’s precisely what CoolIT has accomplished in North America and Asia, thanks in large part to their new Starfield Manufacturing Facility and the Liquid Lab Innovation Centers. Together, these facilities provide nearly 150,000 square feet dedicated to manufacturing and R&D. What’s more, it’s all designed with the singular purpose of meeting multi-gigawatt cooling demands head-on.

The Starfield facility alone spans 112,000 square feet and is home to end-to-end production lines for CoolIT’s full range of direct liquid cooling products — from processor coldplates to coolant distribution units (CDUs). This move isn’t just about scale, it’s about control and agility.

CoolIT’s approach prioritizes speed and quality. When market conditions shift and new hardware designs emerge, CoolIT is poised to respond. They’ve proven this agility repeatedly by quickly ramping new production lines, ensuring customers get what they need, when they need it.

While scale matters, so does the technology behind the products. CoolIT’s reputation rests on engineering precision, robust R&D, and deep collaboration with customers.

Engineering precision is seen throughout the product development process, including incoming quality control, as seen above.

Their Liquid Lab facilities in Calgary and Taipei are among the most advanced data center cooling R&D centers globally. Run by expert engineers and technicians, these labs feature 18 thermal chambers, a 1MW data center simulator, and a suite of testing equipment designed to validate every aspect of liquid cooling performance, reliability, and durability.

CoolIT’s innovation pedigree is backed by more than 100 patents, including their proprietary Split-Flow™ technology featured in their processor coldplates. Their OMNI™ All-Metal Coldplate launched in 2024 embodies this ethos — a metallically sealed, aerospace-grade coldplate that can be prototyped and delivered in weeks rather than months.

The company’s dual innovation hubs in Canada and Taiwan allow it to stay tightly aligned with evolving hardware designs and market requirements, a critical capability given the rapid pace of change in AI hardware.

The engineering doesn’t stop at design. CoolIT’s manufacturing teams use AI-driven optical screening and robotic automation to maintain strict quality standards. Every product undergoes 100% leak and functional system testing. Critical components are dual-sourced and subjected to statistically driven sampling to catch any outliers before products ship.

This isn’t just lip service. CoolIT’s production lines are ISO9001:2015 certified, and their manufacturing is trusted by many of the world’s largest semiconductor companies, cloud providers, and hyperscalers.

There’s a strategic logic to CoolIT’s investment in Calgary. By centralizing North American manufacturing, they improve delivery times, reduce risks related to supply chain disruptions, and ensure greater oversight of product quality.

The scale of demand for AI infrastructure can’t be overstated. AI workloads don’t just require high compute — they generate immense heat that must be managed to maintain performance and uptime. Traditional air cooling has hit its physical limits. Liquid cooling, especially direct-to-chip solutions like those CoolIT provides, offers superior thermal management and energy efficiency. CoolIT’s technology can reduce data center energy use by up to 30% compared to air cooling — a massive win not just for operational costs, but also for sustainability.

Backing this mission are heavyweight investors KKR and Mubadala, whose support is accelerating CoolIT’s growth and R&D ambitions.

Jason Waxman, CoolIT’s CEO, sums it up: “Liquid cooling is essential to enable the future of computing. Our mission is to accelerate AI’s next frontier by removing thermal barriers with leading-edge engineering, scalable manufacturing, and a relentless focus on quality.”

The challenge of AI infrastructure is bigger than ever. But CoolIT is scaling fast and innovating faster, ready to meet the cooling needs that come with the next wave of digital transformation.

To learn more about CoolIT’s full suite of products or to discuss how CoolIT can help meet your cooling needs, visit their product page. IT decision makers are also invited to reach out to the CoolIT team for consultations or inquiries.

Article originally published on HPCwire.