CoolIT: Behind the World’s Most Advanced AI Coldplates

Next-generation AI silicon is driving power density and thermal complexity beyond conventional coldplate designs. Silicon developers need more than a component supplier – they need a direct liquid-cooling innovator who can co-design at the silicon, chip, server and rack levels. 

For over 25 years, CoolIT has been that partner. 

Expertise to solve the toughest problems 

Coldplate design is a systems problem. Flow, pressure drop, thermal resistance, tolerance, manufacturability and reliability all come together. Every new AI platform recasts the tradeoffs. CoolIT’s engineers and technologists live inside that problem every day. 

With deep knowledge of how direct liquid-cooling systems operate and a strong record of technical innovation, including more than 150 liquid cooling patents, CoolIT knows how to solve the toughest advanced computing thermal design challenges. 

A toolkit ready for speed 

AI system designers also need speed. CoolIT delivers a portfolio of pre-engineered, pre-validated building blocks, so advanced coldplate loops come together quickly without reinventing the foundation on every program. 

Customers also leverage CoolIT’s advanced research into novel coldplate geometries, materials and manufacturing methods to address more complex thermal challenges.    

The proof?  Six generations of supercomputer cooled by CoolIT and the ongoing development of coldplate technologies for the industry’s highest-density AI server platforms, including a recently demonstrated 15kW single-phase coldplate.   

Cooling for Every Component = The whole server. 

A modern AI server is a landscape of heat sources and CoolIT engineers cooling for all components inside: 

• Processors: CPUs, GPUs, ASICs and switch silicon 

• Memory: DIMMs, HBM and SOCAMM 

• Networking: OSFPs, QSFPs and NICs 

• Storage: SSDs and E1.S drives 

• Power: VRMs and PSUs 

Component cooling is only part of the story. CoolIT engineers the whole server system, from individual coldplates to server-level loops and rack systems enabling up to 100% heat capture a foundation for ultra-high-density racks beyond 250kW. 

Unmatched capabilities 

CoolIT’s LiquidLab™ innovation centers in Canada and Taiwan put concepts into action — combining prototyping, testing, validation, pilot manufacturing and UL certification under one roof. 

Additionally, CoolIT’s high-volume coldplate loop manufacturing operations in China, Vietnam and Canada turn advanced designs into products at scale, globally delivered. 

Let’s design the next one together. 

The hardest thermal problems in AI silicon are already on our bench. Bring us yours.