Coldplates for AMD Processors

Built for AMD’s most powerful GPU, MI300X coldplates handle extreme thermal loads with precision cooling across large die surfaces and memory stacks.

Optimized for APU integration, MI300A coldplates deliver balanced cooling across CPU and GPU elements, supporting hybrid workloads with consistent thermal performance.

Engineered for legacy HPC systems, MI250 coldplates provide reliable cooling for dual-GPU configurations with proven performance in large-scale deployments.

Built for next-gen EPYC silicon, SP7 coldplates address advanced thermal challenges with tailored designs for maximum heat capture and loop efficiency.

Designed for high core-count and elevated power density, SP5 coldplates provide precision cooling for AMD’s latest EPYC processors in dense server environments.

Coldplates for SP3 platforms deliver reliable cooling for legacy EPYC processors, balancing thermal performance with broad deployment compatibility.