You own a data center and you are looking for the most efficient way to cool it. You want something fast, reliable and dense to reduce energy costs and OPEX, reuse heat or do something more specific.
Rack DCLC utilizes a three module “building block” approach which includes Server, Manifold, and Heat Exchange Modules. This provides customers with product flexibility when integrating liquid cooling into any computer environment or server configuration.
CoolIT Systems Server Modules can cool any combination of CPU, GPU and Memory components, with customization available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service.
The Rack DCLC Manifold Module manages liquid distribution between the Heat Exchange Module and any number of Server Modules. Manifold Modules can be customized to suit any server or rack environment.
CoolIT Systems Rack DCLC product line offers a variety of Heat Exchange Modules depending on load requirements and availability of facility water, including CHx (Liquid-to-Liquid), AHx (Liquid-to-Air) and custom options.
CoolIT’s Closed-Loop Solutions are cooling systems that exist entirely within the desktop or server. A variety of efficient Coldplate Assemblies are installed next to heat-producing components and hot air is then rejected through slim, quiet radiators. The sealed liquid loops ship pre-filled with coolant and installation is comparable to that of a standard heat sink. Many types of Closed-Loop systems are available to both standard and custom rack-mount configurations.
Data centers are using Direct Contact Liquid Cooling to increase rack density, lower overall cooling costs and cool next generation, high powered processor. CoolIT has the broadest selection of liquid cooling solutions on the market and are proud to partner with more server manufacturers than any other liquid cooling vendor in the industry. CoolIT works directly with data center architects, managers and system integrator to asses their needs and provide the best solution possible. The Chip to Atmosphere Cooling Solutions program, created between CoolIT and STULZ, provides one stop shopping for data center cooling needs and ensures a variety of cooling solutions are available to address a range of data center requirements.
Working with CoolIT is practical. Dedicated CoolIT Sales, Engineering and Product Development teams work directly with key data center staff to organize the solution that best fits their needs. CoolIT will manage your liquid cooling project from requirements definition through solution selection, installation and support.