Capturing the heat effectively enables the chips underneath the coldplates to function effectively under 100% load.
Today’s coldplates capture heat not only from the processors, but also surrounding components including high-bandwidth memory, voltage regulators.
Through CoolITs leadership in the HPC market, proven, delpoyed solutions have been developed that capture 100% of the heat dissipated by electronics in a server. Going forward, these solutions will become more critical as the heat from other components rises to keep up with the high-TDP chips.