CoolIT Systems Partners with Intel to Develop Direct Liquid Cooling solutions for Xeon Scalable Processors

 In Press Releases
High density liquid cooling solutions planned for Cascade Lake AP

Dallas, TX. November 14, 2018 – CoolIT Systems, the world leader in modular, scalable data center liquid cooling technology, has partnered with Intel to develop high performance Direct Liquid Cooling solutions for Intel® Xeon® Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in H1 2019.

“CoolIT is proud to support Intel with high density Direct Liquid Cooling,” said CoolIT Systems Vice President of Business Development and Product Marketing, Patrick McGinn. “HPC users can now unlock the benefits of CoolIT technology through any number of industry leading OEM partners including Intel, Cray, HPE, and Dell.”

About CoolIT Systems
CoolIT Systems specializes in scalable liquid cooling solutions for individual servers through to the world’s most demanding data centers and HPC systems. Through its modular, rack-based Direct Liquid Cooling technology, Rack DCLC™, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. From Passive Coldplate Loops specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD, to Rack Manifolds and Coolant Distribution Units (CDUs), CoolIT’s reliable technology installs into any server or rack, ensuring ease of adoption and maintenance. For more information about CoolIT Systems and its technology, email or visit

Media Contact:
Lauren Macready
Marketing Manager, CoolIT Systems
+1 (403) 235 4895 ext. 215


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