CoolIT Systems adds experienced Intellectual Property Counsel

 In Press Releases

IP LEGAL EXPERT TO SUPPORT COMPANY’S STRATEGY AND GROWTH

Stamford, Connecticut. January 30, 2019 – CoolIT Systems, the world leader in scalable liquid cooling technology for data centers and HPC systems, today announced that Ken Dyer has joined the company as Chief Intellectual Property Counsel.

CEO Geoff Lyon commented, “We are thrilled to welcome Ken Dyer to the CoolIT Systems team. Ken’s deep experience in all facets of the legal and business aspects of Intellectual Property will be invaluable as CoolIT builds on its position as the world leader in data center liquid cooling.”

“I am excited to join CoolIT at this point of inflection in the data center liquid cooling market place,” said Ken Dyer. “The Company has created and continues to develop a significant IP portfolio that can be strategically leveraged to support the company’s strategy and growth.”

With over 20 years of experience in private practice as well as several in-house positions, Dyer has built an impressive resume. Before joining CoolIT Systems, Dyer was most recently Vice President, IP Licensing at Silicon Valley based Tela Innovations where he successfully concluded significant deals with world leading technology companies such as Samsung, Qualcomm and TSMC (Taiwan Semiconductor). Previously, Dyer spent several years with Intellectual Ventures in senior IP legal and business roles relating to the monetization of IV’s diverse patent portfolio. Earlier in his career, Dyer represented plaintiffs and defendants in patent litigations before the ITC and US District Courts as a partner at Perkins Coie LLP and as an associate at both Kirkland & Ellis LLP and Wilson Sonsini Goodrich & Rosati.

About CoolIT Systems
CoolIT Systems specializes in scalable liquid cooling solutions for individual servers through to the world’s most demanding data centers and HPC systems. Through its modular, rack-based Direct Liquid Cooling technology, Rack DCLC™, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. From Passive Coldplate Loops specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD, to Rack Manifolds and Coolant Distribution Units (CDUs), CoolIT’s reliable technology installs into any server or rack, ensuring ease of adoption and maintenance. For more information about CoolIT Systems and its technology, email or visit https://www.coolitsystems.com/.

Media Contact:
Lauren Macready
Marketing Manager, CoolIT Systems
marketing(at)coolitsystems(dot)com
+1 (403) 235 4895

Recommended Posts