Coldplates

CoolIT designs coldplates for the full range of silicon inside a liquid-cooled server. For processors like CPUs, GPUs, and ASICs, CoolIT maps the specific thermal profile of each component and engineers a design to match. For peripherals like storage controllers, networking silicon, memory, and power electronics, CoolIT’s peripheral coldplate portfolio covers the unique form factors and thermal targets those components require.

Contact our team with your component and we’ll confirm availability or scope a solution.

CoolIT’s pre-engineered coldplates are validated building blocks designed for standard processor form factors and mounting configurations. They’re the fastest path to qualified thermal coverage for components that fit within those parameters. Custom co-engineered designs start from the thermal map of a specific component and are built through CoolIT’s NPI process: CFD simulation, geometry design, prototyping, and validation, all developed in parallel with your hardware program. Custom work is appropriate when the component’s heat flux, geometry, or mechanical constraints fall outside standard product parameters, or when you need a thermal solution developed alongside your next-generation hardware rather than after it.

CoolIT coldplates have been validated to over 300 W/cm² heat flux. This is a performance level that addresses the thermal demands of current and next-generation high-performance processors. Heat flux is the measure that determines whether a coldplate can actually manage the energy density at the die surface, independent of total package TDP. For components with specific heat flux requirements, [contact our team →] to discuss your design targets. For components with specific heat flux requirements, contact our team.

CoolIT’s validated 15kW coldplate demonstrates single-phase direct liquid cooling performance at the leading edge of current AI platform power envelopes. The tech brief documents the design approach, test methodology, and results, giving system designers and OEM engineers a concrete dataset for roadmap planning. For components pushing beyond current thermal boundaries, contact our team. Thermal targets and design constraints are evaluated on a per-program basis. Download the 15kW Tech Brief.

The earlier, the better; ideally at the concept or early architecture stage, before specifications are locked in. CoolIT’s NPI process uses Advanced Product Quality Planning (APQP) to identify thermal and mechanical risks when they’re still low-cost to address. The engagement typically begins with a requirements alignment between your hardware and thermal teams and CoolIT’s design engineering group, followed by CFD simulation, design reviews, prototype production, and validation testing. Start a co-engineering conversation and we’ll map a program timeline to your hardware roadmap.

Yes. CoolIT’s peripheral coldplate portfolio is designed for the components beyond the main processor that contribute to the server’s total thermal load: high-bandwidth memory, storage controllers, network interface controllers, and voltage regulators and power modules. In high-density AI servers, peripheral thermal management is increasingly as important as processor cooling. Contact us with your component list and thermal targets.

Both. CoolIT’s design, prototyping, validation, and volume manufacturing capabilities are all in-house. This matters for custom programs because it eliminates the handoff risk between a design house and a contract manufacturer; the same team that validates the design transitions it into production. Learn more about CoolIT’s manufacturing capabilities.