Coldplate Technology

Maximizing heat capture is critical to the function of every high-performance processor.

Mastering Micro-Geometry

Understanding how thermal loads are dissipated through silicon, how and why hotspots occur is critical to designing effective coldplates.

CoolIT leverages advanced simulation tools and decades of experience to optimise each and every coldplate design to operate with the best performance for the thermal profile of that chip.

Low Pressure Drop

Split-Flow™ technology drastically reduces internal pressure drop, plus every coldplate features divergent and convergent flow paths.

Low Thermal Resistance

Split-Flow™ technology also reduces case to fluid thermal resistance, lowering processor case and junction temperatures.

Unibody Construction

OMNI™ coldplates use an aerospace grade assembly process to form a single unibody, ensuring maximum simplicity and reliability.

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