SERVER MODULE

CoolIT Systems’ Server Modules can cool any combination of CPU, GPU and Memory components, with customization available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service.

CPU COOLING

CoolIT Systems’ CPU Cooling solutions are managed by centralized pumping architectures. These passive coldplate assemblies are purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis.

R4

The R4 is a passive Coldplate technology employed by CoolIT Systems in centralized pumping architectures. At only 15mm in height, the R4 Passive Coldplate Assembly is purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis, and is guaranteed to withstand over 200psi.

RP2

The CoolIT Systems’ RP2 is a high performance passive component for use in the CoolIT Systems Rack DCLCTM ecosystem. Specifically designed for use with the Intel® Xeon PhiTM Processor Family (Knights Landing), this solution enables 1U chassis applications by meeting the same keep out zone requirements as the 1U air cooler.

Thermally, the solution is optimized for the unique power distribution of the Knights Landing package, to ensure appropriate cooling for both the CPU and the MCDRAM.

RX1

Engineered for the next generation Intel® Xeon® E5 processor (Skylake EP) family, the CoolIT RX1 passive coldplate assembly enables the highest wattage CPUs. Leveraging our patented CoolIT Split-Flow design theory, this passive solution eliminates the need for remote heatsinks, maximizing density in 1U applications.

GPU COOLING

CoolIT Systems’ GPU Cooling product line includes passive assemblies for NVIDIA and AMD.

AMD Firepro S9300 x2

Designed to enable peak compute performance in high temperature environments, this Rack DCLC compatible assembly is a direct replacement for the passive heat sink solution.

Featuring two CoolIT Systems R4 coldplates and a full coverage tray, it is capable of capturing more than 90% of the heat load generated by the card, maximizing reliability and lifespan.

NVIDIA® Tesla® K80 Accelerator

CoolIT Systems manufactures a direct contact liquid cooling system for the NVIDIA® Tesla® K80 Accelerator.

This passive assembly supports the Rack DCLCTM ecosystem and is deployed in conjunction with any CoolIT Systems Heat Exchange Module. The full coverage K80 solution provides cooling the GPUs, memory and power supply components. Its specialized design captures up to 89% of the heat load, ensures peak performance and improves reliability.

GP1

Designed specifically to support the NVIDIA Tesla P100 GPU accelerator, the CoolIT GP1 passive coldplate enables NVIDIA Pascal solutions in 1U applications.

This full coverage coldplate ensures high performance liquid cooling for the entire SXM2 board, and is a drop in replacement for the reference air cooling heatsink.

GP2

Based on the same R4 platform that underpins the GP1, CoolIT continues its tradition of offering the highest performance solutions for NVIDIA® products.

Designed specifically for the new Tesla® V100 (Volta™) accelerator, the GP2 enables the highest density SXM2 platforms by pulling the interface points in from the edge of the coldplate, giving the solution designer greater freedom for tube routing.

MEMORY COOLING

CoolIT Systems’ full coverage Memory Cooling solutions are designed for both standard height memory modules and custom configurations.

Mx1

CoolIT Systems’ Mx1 Memory Cooling solution enables full coverage memory cooling.

This solution, designed for standard height memory modules, routes coolant through an integrated channel in the top of the cooler, simplifying design and minimizing costs.

When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.

Mx2

CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.

Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.

When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.

Mx3

CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.

Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.

When used in conjunction with CoolIT Systems’ processor Coldplates, over 85% of the heat produced by each server can be captured in the liquid loop.

PATENTED SPLIT-FLOW COLDPLATES

coldplate_trans-1024×683

A key component of the Server Module, CoolIT Systems’ patented Split-Flow Coldplates are solid copper components which deliver superior performance for today’s high thermal density processors.

The Split-Flow design uses microchannel architecture to minimize pressure drop, maximize coolant flow, and direct the coolest liquid to the hottest area of the processor first. At only 2.4mm in height, Coldplates are easily integrated into extremely compact, low-profile blade architectures, and allow for optimal performance.

Custom Coldplate designs are available.

HAVE QUESTIONS? WE’RE HERE TO HELP!