RACK DCLCTM

RACK DCLCTM MODULE APPROACH

Rack DCLC utilizes a three module “building block” approach that provides a tremendous amount of product flexibility when integrating liquid cooling into any compute environment or configuration.

SERVER MODULE

MANIFOLD MODULE

HEAT EXCHANGE MODULE

SERVER MODULE

CoolIT Systems’ Server Modules can cool any combination of CPU, GPU and Memory components, with customization available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service.

CPU COOLING

CoolIT Systems’ CPU Cooling solutions are managed by centralized pumping architectures. These passive coldplate assemblies are purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis.

R4

The R4 is a passive Coldplate technology employed by CoolIT Systems in centralized pumping architectures. At only 15mm in height, the R4 Passive Coldplate Assembly is purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis, and is guaranteed to withstand over 200psi.

RP2

The CoolIT Systems’ RP2 is a high performance passive component for use in the CoolIT Systems Rack DCLCTM ecosystem. Specifically designed for use with the Intel® Xeon PhiTM Processor Family (Knights Landing), this solution enables 1U chassis applications by meeting the same keep out zone requirements as the 1U air cooler.

Thermally, the solution is optimized for the unique power distribution of the Knights Landing package, to ensure appropriate cooling for both the CPU and the MCDRAM.

RX1

Engineered for the next generation Intel® Xeon® E5 processor (Skylake EP) family, the CoolIT RX1 passive coldplate assembly enables the highest wattage CPUs. Leveraging our patented CoolIT Split-Flow design theory, this passive solution eliminates the need for remote heatsinks, maximizing density in 1U applications.

GPU COOLING

CoolIT Systems’ GPU Cooling product line includes passive assemblies for NVIDIA and AMD.

AMD Firepro S9300 x2

Designed to enable peak compute performance in high temperature environments, this Rack DCLC compatible assembly is a direct replacement for the passive heat sink solution.

Featuring two CoolIT Systems R4 coldplates and a full coverage tray, it is capable of capturing more than 90% of the heat load generated by the card, maximizing reliability and lifespan.

NVIDIA® Tesla® K80 Accelerator

CoolIT Systems manufactures a direct contact liquid cooling system for the NVIDIA® Tesla® K80 Accelerator.

This passive assembly supports the Rack DCLCTM ecosystem and is deployed in conjunction with any CoolIT Systems Heat Exchange Module. The full coverage K80 solution provides cooling the GPUs, memory and power supply components. Its specialized design captures up to 89% of the heat load, ensures peak performance and improves reliability.

GP1

Designed specifically to support the NVIDIA Tesla P100 GPU accelerator, the CoolIT GP1 passive coldplate enables NVIDIA Pascal solutions in 1U applications.

This full coverage coldplate ensures high performance liquid cooling for the entire SXM2 board, and is a drop in replacement for the reference air cooling heatsink.

GP2

Based on the same R4 platform that underpins the GP1, CoolIT continues its tradition of offering the highest performance solutions for NVIDIA® products.

Designed specifically for the new Tesla® V100 (Volta™) accelerator, the GP2 enables the highest density SXM2 platforms by pulling the interface points in from the edge of the coldplate, giving the solution designer greater freedom for tube routing.

MEMORY COOLING

CoolIT Systems’ full coverage Memory Cooling solutions are designed for both standard height memory modules and custom configurations.

Mx1

CoolIT Systems’ Mx1 Memory Cooling solution enables full coverage memory cooling.

This solution, designed for standard height memory modules, routes coolant through an integrated channel in the top of the cooler, simplifying design and minimizing costs.

When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.

Mx2

CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.

Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.

When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.

Mx3

CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.

Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.

When used in conjunction with CoolIT Systems’ processor Coldplates, over 85% of the heat produced by each server can be captured in the liquid loop.

PATENTED SPLIT-FLOW COLDPLATES

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A key component of the Server Module, CoolIT Systems’ patented Split-Flow Coldplates are solid copper components which deliver superior performance for today’s high thermal density processors.

The Split-Flow design uses microchannel architecture to minimize pressure drop, maximize coolant flow, and direct the coolest liquid to the hottest area of the processor first. Starting at only 2.4mm in height, Coldplates are easily integrated into extremely compact, low-profile blade architectures, and allow for optimal performance.

Custom Coldplate designs are available.

MANIFOLD MODULE

The Rack DCLC Manifold Module manages liquid distribution between the Heat Exchange Module and any number of Server Modules.

RACK MANIFOLD

CoolIT Systems’ Rack Manifolds are made of reliable stainless steel, rendering them incredibly robust. Combined with dry-break, dripless Quick Disconnects from Staubli, these modules are safe and effective building blocks when paired with Rack DCLC Server Modules.

Rack Manifolds are organized for a manual connection at the front or back of the rack. Manifolds are flexible and can be arranged vertically or horizontally within a rack .

Features

  • Stainless steel body
  • Dry-break “dripless” quick disconnects
  • Vertical or horizontal orientation
  • Color-coded for hot and cold

Benefits

  • Easy installation, racks like a PDU
  • No special training required
  • Simple connection and disconnection
  • Enables servers to remain hot swappable
  • Flexible in size and orientation

CHASSIS MANIFOLD

CoolIT Systems’ Chassis Manifolds are integrated into blade-style chassis and use dry-break Quick Disconnects designed to accept a small misalignment between the server and chassis manifold. These blind-mate systems are the reliable and user-friendly way to liquid cool servers.

METAL QUICK DISCONNECTS

Featuring double shut-off valves, these 100% non-drip quick disconnects are made of nickel-plated aluminum alloy to ensure long lasting component reliability and coolant compatibility. Constructed by aluminum alloy with a treated surface and featuring a large number of balls, the quick connectors locking mechanism extremely robust.

Features

  • Plug engages to socket with minimal required force
  • Color-coded sockets for inlet and outlet (blue and red)
  • 100% leak and drip free
  • Constructed with high strength materials
  • Excellent flow
  • Swiss engineered & manufactured

BENEFITS OF METAL QUICK DISCONNECTS IN DIRECT LIQUID COOLING SYSTEMS

Feature Stäubli Metal Quick Disconnects Plastic or Plastic/Metal Combination Quick Disconnects
Structural Integrity All metal construction holds structural integrity extremely well. Stäubli Quick Disconnectss are constructed of brass and stainless steel, with specialized aluminum coatings to avoid corrosion. Creep can occur with plastic material. Dimensional changes can create difficulties connecting and/or disconnecting, which can lead to leakage.
Environmental parameters, such as humidity, ultra-violet exposure, and high or low temperatures, can also affect the stability and dimensions of plastic parts.
Connection Cycles Metal Quick Disconnects are capable of over 5,000 connection cycles due to the wear resistance of metal. The number is manufacturer-dependent, but is generally in the low hundreds.
Quick Disconnect Material Degradation  None.  Material aging is much quicker for plastics than metal, resulting in lower life expectancy of plastic connectors.
Fluid Loss Stäubli CGD, SCG and SPT are true flush face connectors. The volume loss is limited to a “mist” adhering to the face when disconnecting. Plastic Quick Disconnects are less durable than metal Quick Disconnects and will potentially fall out of tolerance, allowing drips to occur.
Heritage of Development Stäubli Quick Disconnects were initially derived for critical sealing industrial applications, such as fuel lines. Plastic Quick Disconnects were developed for the medical industry as single use, disposable items.
Cost of Quick Disconnects Metal Quick Disconnects are generally more expensive than plastic Quick Disconnects; however, metal Quick Disconnects provide for a reliable and safe connection at a critical point in the system and still make up less than 0.5% of the IT system capital costs.  Plastics are a lower cost component which can initially save a few hundred dollars per rack.

Heat Exchange Module

CoolIT Systems’ Rack DCLC product line offers a variety of Heat Exchange Modules depending on load requirements and availability of facility water, including CHx (Liquid-to-Liquid), AHx (Liquid-to-Air) and custom options.

Liquid-to-Liquid heat exchanger which manages a network of IT cabinets

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Cooling Capacity (at 30°C facility water) 650kW
Power Consumption (Max) 4.2kW
Racks per Solution 5-20
ROI (months) 1-6
Facility Water Integration Yes

Designed to manage the distribution of clean, treated coolant to and from a network of IT cabinets, the CHx650 accepts ASHRAE W4 warm facility water and manages 650kW of processor load per network. This stand-alone CHx can be customized to fit various data center environments. Standard equipment groups offer N+1 redundancy and, when used in tandem, can provide tier 4 resiliency.

Features

  • Manages 650kW of processor load per network
  • Supports 40kW+ cooling capacity per rack
  • ASHRAE W4 warm water cooling (2°C – 45°C)
  • Redundant centralized pumps
  • Full control systems

Benefits

  • Dramatically increase CPU/GPU density
  • Eliminate the need for chillers and CRACs
  • Monitor health system remotely
  • Simple installation and maintenance
  • ROI in 1 year or less
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Liquid-to-Liquid heat exchanger which manages a single IT cabinet

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Cooling Capacity (at 30°C facility water) 80kW
Power Consumption (Max) 652W @ 115V AC
Racks per Solution 1
ROI (months) 1-6
Facility Water Integration Yes

The CHx80 Module meets today’s most demanding HPC requirements. Capable of managing 80kW+ of heat load in a remarkably small 4U of space, this system provides cooling for 120 servers or more. The CHx80 Module is an extremely efficient heat exchanger that uses ASHRAE W4 warm water to manage processor and component heat. As a result, users can expect a significant reduction in data center OPEX.

Features

  • Manages 80kW+ of processor load per network
  • ASHRAE W4 (2°C – 45°C) warm water cooling
  • Redundant pumps
  • Dry-break quick disconnects
  • 4.3″ LCD screen with touch functionality
  • Integrated control and monitoring system (Webserver, Modbus, SNMP)
  • Internal and external leak detection and mitigation system
  • 4U rack-mount chassis
  • Integrated fill-pump

Benefits 

  • Dramatically increase CPU/GPU density
  • Reduces the need for chillers with warm water cooling
  • Manages 120+ servers per rack
  • Quick and easy installation and service
  • Uses only 652W
  • Can be located anywhere in a rack
  • Servers remain hot-swappable for service
  • High temperature return water can be used for heat re-use
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Liquid-to-Liquid heat exchanger which manages a single IT cabinet

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Cooling Capacity (at 30°C facility water) 40kW
Power Consumption (Max) 110-120W
Racks per Solution 1
ROI (months) 1-6
Facility Water Integration Yes

The CHx40 Module manages the distribution of clean, treated coolant within a single IT cabinet. This 2U CHx accepts ASHRAE W4 warm facility water and can manage 40kW+ of processor load per rack.

Features

  • Manages 40kW+ cooling capacity per rack
  • ASHRAE W4 (2°C – 45°C) warm water cooling
  • Redundant centralized pumps
  • Integrated control and monitoring system (Webserver, Modbus, IPMI, SNMP)
  • 4.3″ LCD screen with touch functionality
  • Internal leak detection and mitigation system
  • Dry-break quick disconnects
  • 2U rack-mount chassis

Benefits

  • Dramatically increases CPU/GPU density
  • Reduces the need for chillers with warm water cooling
  • Manages 50+ servers per rack
  • Quick and easy installation and service
  • High temperature return water can be used for heat re-use
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Liquid-to-Liquid heat exchanger which manages powerful clusters in limited space

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Cooling Capacity (at 25°C ambient air) 20kW
Power Consumption (Max) 300W
Racks per Solution 1
ROI (months) 1-12
Facility Water Integration No

Rack DCLC AHx20 packs an incredible amount of heat load management into a small form factor. This top-of-rack solution provides superior processor performance and enables very high densities. The AHx20 is perfect for compute environments that are short on space, big on compute and do not have access to facility water.

Features

  • Manages 20kW+ cooling capacity per rack
  • No facility water required
  • Redundant centralized pumps
  • Integrated control and monitoring system (Webserver, Modbus, IPMI, SNMP)
  • 4.3″ LCD screen with touch functionality
  • Internal leak detection system
  • Dry-break quick disconnects

Benefits

  • Dramatically increases CPU/GPU density
  • Stand-alone rack-based liquid cooling
  • Monitor system health remotely
  • Easily upgradable to CHx Module
Rack DCLC

This Liquid-to-Air heat exchanger provides in-rack liquid cooling without facility water

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Power Consumption (Max) 720W
Racks per Solution 1
ROI (months) 1-12
Facility Water Integration No

The AHx10 is a compact 5U, rackmount heat exchanger capable of managing 7kW at 25°C ambient air temperature. This product expands to a 6U and 7U configuration (via the available expansion kit) that manages up to 10kW of heat load. The AHx10 supports front to back air flow management and is compatible with CoolIT Manifold Modules and Server Modules. The system allows users to deploy high density liquid cooled servers inside existing data centers without the requirement for facility liquid. The AHx10 is the perfect solution to manage cooling for HPC racks within an existing facility.

Features

  • 7 – 10kW of heat load management
  • 25°C ambient air temperature
  • Liquid-to-Air heat exchanger
  • Redundant pumping
  • Redundant power supply
  • Compact 5U, rackmount appliance
  • 6U or 7U expansion kit available
  • Integrated monitoring and control system with remote access
  • LCD touch display for quick user interface
  • Rackmount appliance – support cold to hot aisle configuration

Benefits

  • Allows for dramatic density increase and rack utilization
  • Quick and easy installation and service
  • Control and monitoring from LCD or via several network protocols
  • System can be located at any level within the rack
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An essential factory burn-in tool for OEMs and System Integrators

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Power Consumption (Max) 200W
Servers per Solution One 2u four node server
Facility Water Integration No

The AHx2 is a compact, easy to transport air heat exchanger designed to enable factory server burn-in when liquid is not present in the factory. It functions as an important tool for customers wishing to validate DCLC technology with a small number of servers. AHx2 provides direct liquid cooling to four DCLC enabled servers during the burn-in process, and reduces the need for additional  infrastructure. AHx2 is a Liquid-to-Air heat exchanger which dissipates heat from the coolant in the server loop to the ambient environment, and accompanies the servers through the entire burn-in process.

Features

  • 2kW of heat load management
  • Manage four DCLC enabled servers simultaneously
  • Compact size allows the unit to sit on top or beside a server chassis during operation
  • Carrying handle and rubber feet for safe transportation and storage
  • Non-marking skid pad allows the unit to safely sit on top of a server chassis
  • Status light to indicate correct unit operation

Benefits

  • DCLC enabled servers can be thermally tested during the factory burn-in process, without additional expensive liquid cooling infrastructure
  • System travels with the server through factory burn-in process
  • Inexpensive solution for DCLC enabled server burn-in
  • Quick and easy installation and operation

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