ECO-III-1

HIGHER PERFORMANCE FOR YOUR APPLICATIONS

Increased Processing Speed  

Improved Reliability

Grow Server Density

Factory Sealed & Maintenance Free

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  • Features

CoolIT’s technology removes computer component heat, which allows for optimal processor performance within a dense chassis.  Direct Contact Liquid Cooling (DCLC™) efficiency lessens airflow requirements which means dropping fan power in the server.  Reducing fan power can allow higher performance processors to be used without using any additional power for the server.  CoolIT’s DCLC™ allows you to spend your power budget on processing rather than on turning fast fans.

 

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  • Ultra Low Profile ECO III Pump/Coldplate
  • Universal retention, compatible with Intel and AMD
  • High performance v-groove split-flow micro-channel cold plate
  • Integrated temperature sensor available
  • Multi-CPU support available
  • 3 year limited warranty
  • Customizable configurations

 


The ECO III 1U and 2U provide a cooling solution that delivers high efficiency and high performance.  The fin pitch and fluid path of the radiator has been optimized to allow for maximum benefit.  This ensures the ability to remove heat while dramatically reducing fan power.  CoolIT's solutions allow servers to support even the highest power CPU's.