Effective, reliable & easy-to-intergrate DCLC™ solutions.
Two configurations available to meet your unique data center requirements: AHx (Air Heat Exchanger) and CHx (Coolant Heat Exchanger).
Both configurations offer:
- Increase in density; more CPUs per rack
- Higher performance per CPU
- Simple installation and maintenance
- Rack-based DCLC™ with heat exchange to facilty water
- Eliminate or reduce need for chillers and CRAC's
- Measurable data cneter power savings allows for fast ROI
- Rack-level DCLC™ without the requirement of facilty water
- Offers HPC in a variety of compute environments
- Supports overclocked CPUs - higher performance per cor
When compared to other liquid cooling solutions in today’s data center market, CoolIT’s Rack DCLC™ outperforms by a considerable margin.
80% INCREASED RACK CAPACITY
More CPU’s per rack and more CPU’s per data center
25% DECREASE IN CAPITAL EXPENSE
Increased rack density means less IT and infrastructure to accommodate the same kW compute capacity (higher kW per square foot of IT load)
Using hot water cooling to collect and transfer heat loads eliminates the need for traditional chilled water infrastructure and allows for the use of more energy efficient facility liquid cooling (dry coolers)
22% DECREASE IN OPERATING EXPENSE
Reduced energy use in facility cooling infrastructure Read More
CoolIT is an engineering company. Our solutions are engineered solutions. While we have standard products, the majority of our solutions are tailored to each customer’s unique needs and requirements. Many of our competitors have standard offerings with minimal flexibility in product deployment. Other products including, in-row and rear-door, require certain consistencies in order to operate effectively (rack depth, non-traditional floor spacing, space for external cooling/distribution equipment, etc).
The three module approach (Server, Manifold, and CHx) allows us to move and adjust modules as needed. Rack DCLC can adjust and accommodate for any number of environmental conditions. The CHx module can be rack-mount, sit on-top of the rack or be built-into the rack if need be. The Manifold Module can accommodate horizontal chassis’, multiple horizontal chassis’, vertical chassis’, blades, or any other server array. The Server Modules can accommodate single CPU’s/GPU’s, multiple CPU’s/GPU’s or even CPU’s/GPU’s working with cold plates and other types of interposers, heat pipes, or heat spreaders.
CoolIT has a long history of working with small form factor liquid pumps. We currently have over 400,000 units in the field today and enjoy a very low failure rate. In short, CoolIT’s CPU Module is industry leading; cost effective, reliable, small form factor, and allows for flexible routing within a server.
While centralized pumping is not out of the question it does raise challenges and several questions:
- Where would the pump be located?
- The system would require a second pump for redundancy.
- Pumps are not cheap, how will this affect the bill of materials?
- How to balance flow and pressure between central pump and our CPU Modules?
- How many extra joints does adding a pump create?
Centralized rack pumping does not allow for scalable design and deployment. A pump must be pre-selected based on the anticipated max capacity of the room or server it is supplying. A central pump system means that a customer is buying pumping power now that they may not use for some time (both CAPEX and OPEX repercussions). Distributed pumping allows for customers to pay for their pumping needs as they scale. Adding a server or rack? The pumping needs are built into the Server Module.
Air, introduced to the system by QC connections over time, will find its way to the top-most cavity of the system. With the CHx at the top of the rack air will collect in the reservoir. If the CHx is located at the bottom of the rack the air will collect at the top of the manifold. Over time, this air could build up and starve the top Server Modules of fluid.
There is no easy answer to this question. The kW cooling capacity is function of facility flow rate and inlet water. The higher the flow rate and cooler the inlet temperature, the higher the kW cooling capacity. The theoretical maximum is very high – high enough that a project would be gated by the amount of power available at the rack not by the size of the CHx.
A quick answer to this question could be 50kW + however the appropriate response should be to explain the function with flow rate and inlet temp and ask questions about the customer’s facility and their requirements.
Traditionally, the server side fluid that collects the heat load from the server is:
13% propylene glycol
1% anti-corrosion package
1% anti-fungal package
This formula has been used in CoolIT desktop solutions for several years and has proved to have not only desirable environmental benefits but also best performance.
The facility liquid can be any number of fluids. Water, propylene glycol, or a mix thereof will be most common. This decision will be driven by the requirements of the dry-cooler, cooling tower or other liquid cooling module used in cooling the facility water.
FEP is server grade material and rubber is not. FEP tubing has a much lower water vapor transmission rate (WVTR) than rubber. FEP can manage much higher pressure ratings that rubber. Rubber can be used in some environments (i.e. desktop solutions) when designed and selected properly. A nylon ‘braid’ or ‘weave’ should be present inside the tubing to ensure structural integrity and that the tube does not slip off the barb. Some of our competitors use rubber tubing that does not have a braid.
Each server module is moving liquid at ~.5 litres/min @ ~3psi. The flow rate and pressure on the facility side will depend on facility plumbing and the kW capacity required at the rack. See more below.
All internal rack plumbing is pre-installed and ready for integration with facility plumbing. The only rack plumbing that needs to be considered on a per project basis is the termination of the rack’s facility inlet/outlet tubing and the placement of the inlet/outlet. If accepting liquid at the bottom of the rack we bring tubing up to the CHx along the manifold (integrated in design). If racks will not be moved CoolIT suggest a threaded or clamped fitting where as if the rack could be moved from one location to another we suggest a quick disconnect coupling method (also easiest for technician).
In some cases, plumbing and facility liquid cooling may be managed by the facility. In these situations Rack DCLC cabinets are dropped into a data center and integrated into the current liquid loops.
In other situations, CoolIT is asked to help develop the liquid loop on the facility side. We have partners and resources to manage these types of requests. Pumps, coolers, and liquid runs will be designed based on data center requirements and could include a software level that manages all of these pieces (can manage inlet temps, flow rates, etc to each rack).